PCB System Design and Custom Footprint Optimization Showcase
Designers need to make themselves aware of all the variables involved to properly design their boards for high performance. The quality of surface mount connections is dependent on several parameters, such as substrate thickness and board-stack-up. Designing high performance PCB systems is as much about schematic design and engineering as it is about creating a stable layout on your board.
Looking at the IoT space, smart-industry environments, avionics, and upcoming areas like 5G and autonomous vehicles, you will find many parallels in these areas. Power integrity is an important issue in high performance PCB systems design as power instability can influence signal instabilities. Similarly, signal integrity problems have always become more prominent as data rates increase to Gbps levels and rise/fall times in digital signals decrease to ps levels. Add to this the fact that many advanced systems are mixed signal devices, and your stack up, layout, and routing design become critical aspects that drive performance.
Learn why the RF connector experts from Rosenberger recommend your PCB layout will determine the most important aspects of your board’s power and signal integrity, and what we can do to support this phase of your design.
