Rosenberger at IMS 2025 – Innovation on Display in San Francisco

This year’s International Microwave Symposium (IMS 2025) in San Francisco was a dynamic showcase of the latest breakthroughs in RF, microwave, and millimeter-wave technologies—and Rosenberger was proud to be at the center of it all. From unveiling our newest product innovations to engaging with industry leaders, partners, and customers, IMS 2025 was an incredible platform to demonstrate how we’re driving the future of high-frequency design and performance.

HPX^™ Product Launch

At IMS 2025, we proudly introduced the HPX^™ Compression‑Mount Interconnect System, our game-changing, solderless solution aimed at ultra‑high frequency and high-density applications. This innovative design supports frequencies up to 110 GHz per lane, utilizing a sleek one-piece, direct‑to‑board interface—all without solder.

Key Highlights:

Solderless and reusable: no need to discard the connector with the board—HPX^™ can be easily detached and reused across multiple setups.
Compact and efficient: 2.54 mm pitch, enables board‑to‑board distances under 9 mm, and eliminates push‑on PCB connectors.
Cost-effective & field-repairable: serrated-tip signal and ground contacts support easy serviceability.
Versatile configurations: available in single/double rows, 1/2/4/8/16 channel setups, staggered high‑density, edge-launch, and board‑to‑board variants.

Why It Matters:

The HPX^™ connectors are ideal for environments where frequency performance meets space constraints—perfect for:

Semiconductor development, validation, and characterization
Server and data‑center testing
High‑reliability defense systems
Medical equipment requiring precision interconnects

With HPX^™, we’ve delivered a precision-engineered, high-bandwidth interconnect solution that dramatically simplifies integration—no soldering required. It’s compact, robust, repair-friendly, and perfect for next‑gen high-frequency applications. IMS 2025 attendees got an in-depth look at how HPX^™ is setting new standards in both density and performance.

Learn more about HPX

Pushing Performance Boundaries: AI-Enhanced HPX Footprint Hits 85 GHz

This year at IMS 2025, Rosenberger demonstrated an interconnect footprint optimization utilizing Artificial Intelligence/Machine Learning (AI/ML). The design process begins by placing the interconnect, HPX our new compression mount system, on a vertical mount stripline breakout template. Next, the 3D field solver simulation is configured with a return loss target from DC - 90 GHz. Parameters are optimized within manufacturing constraints. In this case, the resulting footprint for our HPX product family demonstrated excellent performance, reflections below 20dB up to 85 GHz, while also ensuring a robust manufacturable design for our customer.

This AI/ML technology is being deployed for our signal integrity workflows to support optimization of customer footprints and correlation of measured vs. simulated data.

NEW – Nano-D and Micro-D High-Speed Rugged Hybrid Interconnects

This year, Rosenberger revealed our latest interconnects: Nano-D and Micro-D

Nano-D and Micro-D connectors are becoming a staple of the military/aerospace industry by providing high reliability connector designs for use in everything from aircraft and missile control to autonomous weapons in the battlefield.

Stay tuned for more information on Nano and Micro-D as we get closer to launch!

Download Nano-D Flyer

Expanding the SMPX^™ Ecosystem – Bigger, Bolder, More Capable

On the heels of our IMS presence, we’re excited to announce a significant expansion of the SMPX^™ product line—reinforcing its position as a solderless, high‑density, multiport RF interconnect platform operating up to 110 GHz per lane.

What’s New?

We’ve added a range of new components and accessories to deliver versatility and flexibility across deployment scenarios:

Female Vertical Mount PCB Connectors
PCB Connector Accessories for enhanced installation and maintenance
SMPX Male to Precision Cable Assemblies
SMPX Male to Male Cable Assemblies
SMPX Female to Male Cable Assemblies
SMPX to SMPX Twinax Cable Assemblies
Right‑Angle to Precision Cable Assemblies
Right‑Angle to Right‑Angle Cable Assemblies
Evaluation Kits for rapid integration and testing

Why It Matters

The expanded SMPX family maintains all the core strengths that make it an ideal RF solution:

Solderless, blind‑mate design with exceptional channel alignment and >10,000 mating cycles
Compact 2.54 mm pitch supporting both single and dual‑row configurations of up to 16 channels
Supports coplanar waveguide and stripline PCBs, and delivers low insertion and return loss across the bandwidth

Catalog & Documentation

To make it easy for system designers, we’ve updated our catalog with added SMPX part numbers, detailed specs, and breakout illustrations. Whether you're sourcing connectors, cable assemblies, or accessories—everything you need is now conveniently documented and readily available.

Download the updated catalog

With these additions, our SMPX ecosystem now offers end-to-end RF connectivity—from PCB connectors and precision cable runs to evaluation tools. It’s a complete, solderless solution built for flexibility, robustness, and performance—ideal for test systems, data centers, aerospace, and more. Stay tuned for case studies illustrating SMPX in action!

Learn more about SMPX

Your Contact Person at Rosenberger North America

Vice President - Military & Aerospace

Mohsin Peeran

Rosenberger North America - Akron
309 Colonial Drive
Akron PA 17501
United States

Phone: +1 717 859-8900