IMS 2026 Recap: Rosenberger Advances High-Frequency Innovation in Boston

We’re excited to share the highlights from our participation in the International Microwave Symposium (IMS) 2026 in Boston, Massachusetts! Rosenberger showcased our cutting-edge RF and microwave interconnect solutions tailored for the demanding requirements of test & measurement, aerospace & defense, high-performance computing and emerging high-frequency applications. If you missed us at IMS this year, explore the products and technologies we featured below. We look forward to connecting with you at future events!

Product Spotlight: SMPX^™ and HPX^™ High-Performance Interconnect Systems

On the show floor, Rosenberger highlighted our flagship high-density, high-frequency interconnect families engineered for performance up to 110 GHz.

SMPX^™ Solderless Multiport System: This compact solution supports up to 110 GHz per lane with a 2.54 mm pitch and data rates reaching 224 Gb/s. Featuring a blind-mate interface, excellent channel alignment and durability exceeding 10,000 mating cycles, SMPX is ideal for ATE testing, semiconductor development and high-performance computing. Its solderless design simplifies installation and maintenance while supporting coax and twinax cable assemblies in single- or double-row configurations.
HPX^™ Compression Mount System: A breakthrough in board-to-board connectivity, the HPX system offers a one-piece, solderless compression-mount interface with serrated tip signal and ground contacts for direct, low-loss PCB connections. It eliminates traditional push-on connectors, provides field-repairability and supports high-density configurations (including staggered layouts) with board-to-board spacing under 9 mm. Perfect for semiconductor validation, server/data center testing, defense and medical applications.

Download the SMPX Catalog

Download the HPX Catalog

Latest Advancements in RoProxCon^® Contactless Technology

Ideal for harsh or dynamic industrial environments, Rosenberger also showcased significant updates to our RoProxCon^® line of contactless interconnect solutions, which enable high-speed data and power transmission without physical contact.

Key highlights at IMS included the newly released Hybrid and Data adaptors, expanding integration options for real-world applications:

RoProxCon^® Hybrid: Combines power (up to 30 W) and data transmission with integrated Gigabit Ethernet support (e.g., EtherCAT, PROFINET). Features hermetic sealing and foreign object detection (FOD).
RoProxCon^® Data: Focused on high-performance data-only connectivity with the same rotation and sealing advantages.

Additional options include the compact System-on-Module (SoM) (14.2 x 12.5 mm) and a dedicated Evaluation Board for rapid prototyping and testing. Delivering wear-free, maintenance-free performance where traditional connectors fall short, RoProxCon^® is also well-suited for Single Pair Ethernet (SPE) applications in robotics, tool changers, machinery and plant engineering.

These advancements open new possibilities for robotics, automation and rotating systems by eliminating cable fatigue and mechanical wear.

Learn more about RoProxCon^®

Precision Connectors for Metrology and High-Accuracy Applications

Rosenberger also presented our extensive line of precision connectors and adapters, designed for laboratory, R&D, testing and quality assurance environments where repeatability and low-wear performance are critical. Manufactured with tight tolerances using high-quality materials like stainless steel and copper beryllium, these connectors deliver reliable coupling for vector network analyzers (VNAs) and other precision test setups.

Discover the Precision Matrix

Introducing Micro and Nano Series Connectors

A major highlight at IMS 2026 was the debut of our brand-new Micro-D and Nano-D connector families, expanding Rosenberger’s portfolio of compact, rugged interconnects for size- and weight-constrained applications in aerospace, defense, and beyond.

Micro-D (MIL-DTL-83513 compliant) and Nano-D (MIL-DTL-32139 compliant) series offer three variants each:

Standard — High-density signal interconnects with fine pitch (0.050" for Micro, 0.025" for Nano) and multiple contact counts.
X (RF) — Enhanced 50-ohm RF performance in ultra-compact footprints.
Differential — Optimized for high-speed differential signaling with 50-ohm RF capabilities.

These connectors provide vertical and horizontal PCB mounting options, cable assemblies and are built for reliability in satellites, UAVs, guided munitions, radar, data centers and more. Their shock- and vibration-resistant designs make them staples for military and aerospace systems. More detailed technical information and full portfolios will be available soon.

Learn more about Micro-D

Learn more about Nano-D

Thank You for Joining Us at IMS 2026!

Thank you to everyone who visited our booth and engaged with our team. Your feedback and discussions help drive Rosenberger’s next-gen solutions.

Stay connected with us for upcoming product releases on the Micro and Nano series and follow our LinkedIn for the latest in high-frequency interconnect technology. We look forward to seeing you at the next event!

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Your Contact Person at Rosenberger North America

Vice President - Military & Aerospace

Mohsin Peeran

Rosenberger North America - Akron
309 Colonial Drive
Akron PA 17501
United States

Phone: +1 717 859-8900