DesignCon 2026: Recap of Innovation in AI, Quantum and High-Density Interconnects

We’re excited to share the highlights from our participation in the recent DesignCon 2026 expo in Santa Clara, California! Rosenberger showcased our latest products and technologies, including a technical session from our very own Sr. Principal Signal Integrity Engineer, Raul Stavoli. If you missed us at DesignCon this year, check out the content and products we presented below. We look forward to seeing you in 2027!

Technical Session: Engineering the 448 Gb/s Frontier

A cornerstone of our presence was the technical session led by our Sr. Principal Signal Integrity Engineer, Raul Stavoli, titled “Simulation Next-Gen AI Interconnects: Optimizing to 448 Gb/s and Beyond.”

As AI and accelerator-based systems push bandwidth requirements to unprecedented levels, the industry faces a critical challenge: Validating interconnects at frequencies exceeding 90 Ghz and data rates approaching 448 Gb/s. This session, sponsored by Cadence, detailed a revolutionary, scalable SI workflow that treats simulation with the same rigor as manufacturing. By integrating 3D mechanical models with machine-learning-based solvers, we’ve created “simulation tooling.” This approach includes standardized, reusable workflows that allow engineering teams to efficiently explore massive design spaces.

The demonstration highlighted the trade-offs between edge, angled and vertical launch configurations, providing a roadmap for SI teams to meet the evolving demands of PAM4 signaling and next-gen PCIe interfaces.

Pioneering the Quantum & Cryogenic Market

Beyond the data center, Rosenberger is making significant strides in the emerging Quantum and Cryogenic sectors. Our connectivity solutions are engineered to withstand the extreme environments of ultra-low temperature dilution refrigerators, often operating near absolute zero.

Key highlights of our quantum portfolio include:

Multichannel WSMP^® Series: Designed for high-density applications up to 100 GHz with optimized thermal coupling for cryostats.
Non-Magnetic Solutions: Essential for maintaining qubit coherence, our connectors use specialized materials and AuroDur^® plating to eliminate magnetic interference.
Hermetic Feedthroughs: Achieving leak rates of ≤ 10^-8 mbar * l/s to ensure vacuum integrity in critical research environments.

Join us next at APS: We are excited to announce that Rosenberger will also be exhibiting at the APS (American Physical Society) March Meeting, where we will further showcase our role in moving quantum technology from the lab to practical application.

Learn more

Product Spotlight: HPX and SMPX Product Lines

On the show floor, we showcased our flagship interconnect families designed for high-density, high-frequency performance.

Our SMPX^™ Product Line is a solderless multiport system that supports up to 110 GHz per lane. With a compact 2.54 mm pitch and the ability to support data rates of 224 Gb/s, it is the ideal choice for ATE testing, semiconductor development and high-performance computing. Its blind-mate interface and >10,000 mating cycle durability make it a reliable solution for the most demanding environments.
The HPX^™ Compression Mount System represents a breakthrough in high-density board-to-board connectivity. Featuring a one-piece, solderless interface with serrated tip signal and ground contacts, the HPX system ensures a direct, low-loss connection to the PCB. It is specifically designed to eliminate the need for traditional push-on PCB connectors, offering a field-repairable and cost-effective solution for 110 GHz application.

Download the SMPX^™ Catalog

Download the HPX^™ Catalog

Your Contact Person at Rosenberger North America

Vice President - Test & Measurement

Neal Rambhia

Rosenberger North America - Akron
309 Colonial Drive
Akron PA 17501
United States

Phone: +1 717 859-8900