DesignCon 2023

January 31 - February 2

Santa Clara Convention Center, Santa Clara, CA

DesignCon is the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.

Join fellow engineers at DesignCon and cover all aspects of electronic design. Attend the expertly curated, 14-track conference created by engineers for engineers, browse exhibits with hundreds of new products and technologies, and network with high-caliber industry professionals over the three-day event. Visit us at booth #1047!

Learn more at

WSMP NexGen Q&A and Booth Beer Crawl

February 1 & 2 at 4:30 p.m. - Booth #1047 - Product Manager, Bruce Cardwell, and Vice President, Nick Parker

Last year at DesignCon 2022, Test & Measurement Product Manager at Rosenberger North America, Bruce Cardwell, presented a product showcase on our WSMP NexGen product series.  Cardwell developed the WSMP NexGen and during his 2022 presentation, he defined the benefits of the connector series and how it expanded to include PCB Connectors, adaptors (bullets), multipin connectors and cable assemblies.  

This year, Rosenberger North America's Sales & Marketing Vice President, Nick Parker, will be joining Cardwell in an in-depth Q&A on the WSMP NexGen series.  This Q&A will delve into applications you may not have thought about, eliminating barriers to adoption and how the WSMP NexGen series can be used by the American Military & Aerospace market.  

Rosenberger’s WSMP NexGen connectors offer true, 100 GHz performance in a small, high-density package. 

Bring your stein and join us for a keg of beer after the Q&A!

Watch the 2022 Showcase

Download Catalog

Your contact person at Rosenberger North America

Vice President - Test & Measurement

Neal Rambhia

Rosenberger North America - Akron
309 Colonial Drive
Akron PA 17501
United States

Phone: +1 717 859-8900