HPX Compression Mount High Performance Interconnect System

Covering a frequency range up to 110 GHz per lane while maintaining a consistent impedance profile with low insertion and return loss, our HPX solderless multiport system connectors and cable assemblies are excellent for high frequency applications where design density limitations matter.

Features and Benefits

• Blind-mate Interface
  • 60 grams mate force per channel
  • ~zero de-mate force
• Solderless Mounting
• Frequency up to 110 GHz (50 ohms)
• Standard Pitch 2.54mm
• Less than 9mm Board to Board
• Eliminates push-on PCB connectors
• Field repairable
• Cost effective
• Serrated Tip Signal and Ground Contacts
• Multiple Standard Configurations

Applications

• Semiconductor
  • Development Reference Design
  • Validation
  • Characterization
• Server/Data Center Test
• Defense Applications
• Medical

Configurations

• Single or Double rows
• Single, 2, 4, 8, 16 channels
• High-Density Staggered
• Single Row Edge
• Single Channel
• Board to Board